Product Description
This product adopts COB packaging technology, which is different from the traditional SMD surface-mount packaging. It integrates the light-emitting chips on the PCB instead of soldering them to the PCB one by one. This technology effectively improves the reliability, luminous color, and protection performance of the LED display.
>> Scope of application
This technical parameter is only applicable to the 600X337.5mm COB module and supporting cast aluminum box in the Mermaid Optoelectronics room.
>> Features
1. General standardized 600x337.5x32.5mm 16:9 ultra-thin cabinet design;
2. Optional P0.93, P1.25, P1.56, P1.87 point pitch;
3. The light-emitting viewing angle can reach 170 degrees, and the viewing angle is wider;
4. Choose large-size high-quality raw material chips, pure gold bonding wires, and the pads are made of immersion gold technology;
5. The full-flip-chip technology is equipped with a common cathode solution, which has good stability, low energy consumption and energy saving;
6. High brush and low gray, refresh rate up to 3840HZ, gray scale 14Bit (software open 16Bit);
7. Low heat generation and excellent heat dissipation; low light decay, prolonging the service life;
8. Waterproof, dustproof, anti-oxidation, anti-static, anti-collision;
9. Point-to-point matching 2K/4K/8K resolution, complete front maintenance design.
Module Specifications
Cabinet Specifications
Module Structure and Appearance
Cabinet Structure and Appearance
Specifications